| AWS Specifications | : | BCuP-5 |
| Applicable Materials | : | Copper to Copper~Copper to Brass |
| Brazing Temperature Range | : | 1,300-1,500 F |
| Composition | : | Silver~Copper~Phosphorus |
| Diameter | : | 0.125 x 0.05 in |
| Flow / Liquidus Temperature | : | 1,300 F |
| Flux Coated | : | No |
| Melting / Solidus Temperature | : | 1,190 F |
| Package Quantity | : | 28 |
| Product Family | : | HANDY-FLO 6 |
| Product Type | : | Brazing Rod |
| Shape | : | Stick |
| Shipping Weight | : | 1 lbs |
| Silver Content | : | 6 % |
HANDY-FLO 6 is a silver-copper-phosphorus brazing alloy developed for creating strong, reliable joints in the HVAC/R industry. It is ideal for connecting copper-to-copper or copper-to-brass components such as pipes, fittings, and coils.This alloy is self-fluxing when used on copper-to-copper connections. To ensure proper bonding on copper alloys like brass, a separate flux is recommended. Note that this product is not suitable for use on ferrous or nickel-based metals.